IPC Seminar Programme
World-class industry expertise at your disposal
Since the IPC - Association Connecting Electronics Industries® - prides itself on representing today’s assembly and production industry, we guarantee the exclusive workshops will feature something for everyone!
Our colleagues at the IPC have developed this line-up that is highly relevant to exhibitors and visitors alike, delivering the latest information on industry advancements, emerging technologies and market research. What’s more, the timing of the seminars is carefully managed to allow you to visit the wealth of attractions on the show floor.
And, when you have visited the seminars and workshops relevant to your business, you can always chat to one of the IPC industry experts on hand to answer your questions
£175 for a full-day seminar, or two ½ day seminars;
£95 pounds for one ½ day.
Use this link to register - http://www.registerbynet.com/shows/nelectronics08conf
Tuesday June 17, 2008
| Time | Seminar | Room |
| 09:00 – 17:00 | Achieving High Reliability for Lead-Free Solder Joints – Material Considerations Ning-Cheng Lee, Ph.D., Indium Corporation of America | Victoria Room (S-01) |
| 09:00 – 12:00 | Designing PCBs for Lowest Cost-Reducing Layers and Other DfM Principles Happy Holden, Mentor Graphics | Harbour Room (S-02) |
| Surface Mount Technology: Principles and Practice in a Lead-Free World Ray Prasad, Ray Prasad Consultancy Group | Whitehall Room (S-04) | |
| 14:00 – 17:00 | Updating Rework and Repair for Lead Free Barry Morris, Advanced Rework Technology-A.R.T | Harbour Room (S-03) |
| Lead-Free Reliability for Harsh Environment Electronics Jennie Hwang, Ph.D., H-Technologies Group | Whitehall Room (S-05) |
Wednesday June 18, 2008
| Time | Seminar | Room |
| 09:00 – 17:00 | Design for Reliability, Reliability Testing & Data Analysis, and Failure Analysis of Lead-Free Solder Joints John Lau, Ph.D. Institute of Microelectronics | Victoria Room (S-06) |
| What is HDI? Do You Need HDI? How To Get Started Happy Holden, Mentor Graphics | Harbour Room (S-07) | |
| 09:00 – 12:00 | Lead-Free BGA Reliability in Packaging & Assembling Jennie Hwang, Ph.D., H-Technologies Group | Whitehall Room (S-08) |
| 14:00 – 17:00 | Ball Grid Array: Principles and Practice Ray Prasad, Ray Prasad Consultancy Group | Whitehall Room (S-09) |
Thursday June 19, 2008
| Time | Seminar | Room |
| 09:00 – 12:00 | Stencil Printing Process for Solder Paste Application: An In-Depth Look S. Manian Ramkumar, Ph.D., Rochester Institute of Technology | Harbour Room (S-10) |
| Reliability Issues With Lead-Free Soldering Processes Werner Engelmaier, Engelmaier Associates L.C. | Victoria Room (S-12) | |
| True Design for Reliability: Understanding What Is and What Is Not DfR Craig Hillman, Ph.D., DfR Solutions | Whitehall Room (S-14) | |
| 14:00 – 17:00 | Advanced Component Packages – An Introduction Including Lead-Free Implementation S. Manian Ramkumar, Ph.D., Rochester Institute of Technology | Harbour Room (S-11) |
| Interconnect Failures and Design for Reliability for Plated-Through Holes/Vias (9PTHs/PTVs) Including Lead-Free Soldering Impact Werner Engelmaier, Engelmaier Associates L.C. | Victoria Room (S-13) | |
| Understanding Failure and Root-Cause Analysis in Lead-Free Electronics Craig Hillman, Ph.D., DfR Solutions | Whitehall Room (S-15) |
