See it, hear it and do it at NEW

“Spend a couple of hours with the POP Team and you will have a significant advantage when specifying or implementing this technology in the future”
Bob Willis - POP Centre Coordinator

Package on Package (POP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on design and assembly engineers. POP is also finding favour in professional handheld tablets and commercial high reliability applications? Package on package is new to many engineers but ready to explode in the market place

In simple terms PoP represents the stacking of area arrays one on top of another, either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include flip chip, wire bonding or conductive adhesives for device to device interconnection. The second generation of devices feature finer pitch and through vias for greater interconnection.

PoP is new to many contract and OEM assembly staff but with the demands of paste or flux dipping, reflow warpage, increased placement accuracy and flexability during paste application during assembly and rework gaining knowledge and experience is vital your competitive edge. The difficulty in multi level ball inspection can be a challenge for standard x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.

What will you see or learn at the PoP Centre?

PoP components explained
PCB design rules and PCB specification
Changes necessary in the assembly process
In process inspection criteria
Solder joint reliability data

What will you see live at the POP Centre?

Placement of PoP
In process Inspection of package assemblies
Application of dip paste and dip flux
Rework of POP and inspection
POP process defects – causes and cures

What benefits will your company get from visiting the POP Centre

Learn PoP Technology from A-Z
Handle PoP samples
Faster implementation of the technology
Obtain inspection standards for your line
Hands on assembly, inspection and rework

“Package on Package (POP) Defect – Causes & Cures”
Even if you are running package on package we have solutions for you. This year the POP Centre will give you the opportunity to have your POP failures or process defects examined by recognised experts on the subject. You can bring board assemblies, components, and failure analysis reports for discussion and free advice to help you pin point the true cause of failure. You can email your questions or problems before the show and book an appointment. Email your photographs and problems prior to your visit to popcentre@new-expo.co.uk

Package On Package Technology Supporters

ALMIT
ALR Printed Circuits
Mydata
Nordson DAGE
O’Dell Rework
Practical Components
SMTA
ZEN Production Equipment
ZPEL –Asscon

PoP Centre sponsored by Global SMT magazine

Package on Package (POP)
Design & Assembly Centre Seminars

Attend the daily 30min seminars and you and your company will receive a copy of each of the slides and access to a video library of each of the presentations to assist your company staff to successfully implement PoP. This is unique and available to New visitors and repeated daily

11.00am Design Guidelines for PoP – Bob Willis
12.00 noon Assembly Process Challenges with PoP – Edwin de Blauw, MYDATA
1.00pm Inspection Guidelines for Package on Package – Keith Bryant, DAGE
2.00pm How to Rework POP Assemblies with Confidence – Jason O’Dell, O’Dell Rework

SMTA Technical Library on PoP Technology

Visitors to the POP Centre will benefit from exclusive access to over 200 technical papers covering Package on Package and stacked packaging technology.

This is a unique opportunity to access and learn from one of the largest collection of technical papers made possible by SMTA. “Having worked for many years with SMTA, a worldwide organisation I know the quality of the material and it’s great to be able to access this resource for NEW visitors” said Bob Willis the POP Design & Assembly Centre Organiser. Having the opportunity to learn from so many sources will make a company’s introduction of POP so much easier. The hundreds of technical papers focus on design, assembly, reliability and so much more.